DAF thermal pressure bonding machine is suitable for the surface heat pressure adhesion of DAF membrane and LGA.Realize DAF automatic stripping, automatic alignment of CCD, automatic hot pressing of Bondhead, automatic upper and lower rail feeding.
(1) precision of the bonding: 0.5mm. 2. Control of pressure digital display control, real-time monitoring 3. Lower limit of pressure head: micrometer adjustment limit, percentage table as the actual data calculation, and accurate pressure on the product.
Ø transmission structure of assembly line type, respectively product fixture to prepressing pressure head and two independently moving head groups below (longitudinal mobile this small and light pressure group, high degree of smooth operation)
Ø when photoelectric sensor perceived fixture, fixture in order to higher under the platform