Purpose: to apply the ACF hetero gel to TP, LCD, FPC or PCBA
Actual process: ACF conductive adhesive pre-attached
Adhesion principle: to use the constant temperature and heat pressure state to achieve the effect of the adhesion of non - blister conductive particles.
State way: the whole roll of ACF conductive adhesive automatic half - cutting prepaste on the base material by stripping the protective film.
Model description:
Bks-acf200 single stage ACF pasting machine (platform in and out type)
Bks-acf300 multi-stage ACF pasting machine (platform XY axis bi-directional mobile)
Heating mode:
Thermostatic heating